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  preliminary km718v987 256kx36 & 512kx18 synchronous sram - 1 - rev 0.2 sep. 1998 KM736V887 document title 256kx36 & 512kx18-bit synchronous burst sram the attached data sheets are prepared and approved by samsung electronics. samsung electronics co., ltd. reserve the right to c hange the specifications. samsung electronics will evaluate and reply to your requests and questions on the parameters of this device. if you have any ques- tions, please contact the samsung branch office near your office, call or contact headquarters. revision history rev. no. 0.0 0.1 0.2 remark preliminary preliminary preliminary history initial draft change dc characteristics. i sb value from 60ma to 90ma at -8 i sb value from 50ma to 80ma at -9 i sb value from 40ma to 70ma at -10 i sb1 value from 10ma to 30ma i sb2 value from 10ma to 30ma 1. changed tcd from 8.0ns to 8.5ns at -8 2. changed tcyc from 13.0ns to 12.0ns at -10 3. changed dc condition at icc and parameters i cc ; from 300ma to 350ma at -8, from 260ma to 300ma at -9, from 220ma to 260ma at -10, i sb ; from 90ma to 130ma at -8, from 80ma to 120ma at -9, from 70ma to 110ma at -10, draft date april. 10 . 1998 aug. 31. 1998 sep. 09.. 1998
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 2 - rev 0.2 sep. 1998 KM736V887 256kx36 & 512kx18-bit synchronous burst sram the KM736V887 and km718v987 are 9,437,184-bit synchro- nous static random access memory designed for high perfor- mance second level cache of pentium and power pc based system. it is organized as 256k(512k) words of 36(18) bits and inte- grates address and control registers, a 2-bit burst address counter and added some new functions for high performance cache ram applications; gw , bw , lbo , zz. write cycles are internally self-timed and synchronous. full bus-width write is done by gw , and each byte write is per- formed by the combination of we x and bw when gw is high. and with cs 1 high, adsp is blocked to control signals. burst cycle can be initiated with either the address status pro- cessor( adsp ) or address status cache controller( adsc ) inputs. subsequent burst addresses are generated internally in the system s burst sequence and are controlled by the burst address advance( adv ) input. lbo pin is dc operated and determines burst sequence(linear or interleaved). zz pin controls power down state and reduces stand-by cur- rent regardless of clk. the KM736V887 and km718v987 are fabricated using sam- sung s high performance cmos technology and is available in a 100pin tqfp package. multiple power and ground pins are utilized to minimize ground bounce. general description features logic block diagram ? synchronous operation. ? on-chip address counter. ? self-timed write cycle. ? on-chip address and control registers. ? v dd = 3.3v 5% power supply. ? 5v tolerant inputs except i/o pins. ? byte writable function. ? global write enable controls a full bus-width write. ? power down state via zz signal. ? lbo pin allows a choice of either a interleaved burst or a lin- ear burst. ? three chip enables for simple depth expansion with no data contention. ? asynchronous output enable control. ? adsp , adsc , adv burst control pins. ? ttl-level three-state output. ? 100-tqfp-1420a package. clk lbo adv adsc adsp cs 1 cs 2 cs 2 gw bw we x oe zz dqa 0 ~ dqd 7 or dqa0 ~ dqb7 burst control logic burst 256kx36/512kx18 address control data-in address counter memory array register register logic c o n t r o l r e g i s t e r c o n t r o l r e g i s t e r a 0 ~a 1 a 0 ~a 1 or a 2 ~a 18 or a 0 ~a 18 dqpa ~ dqpd a 0 ~a 17 a 2 ~a 17 (x=a,b,c,d or a,b) dqpa,dqpb fast access times parameter symbol -8 -9 -10 unit cycle time t cyc 10 12 12 ns clock access time t cd 8.5 9.0 10.0 ns output enable access time t oe 3.5 3.5 3.5 ns output buffer
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 3 - rev 0.2 sep. 1998 KM736V887 pin configuration (top view) pin name symbol pin name tqfp pin no. symbol pin name tqfp pin no. a 0 - a 17 adv adsp adsc clk cs 1 cs 2 cs 2 we x(x=a,b,c,d) oe gw bw zz lbo address inputs burst address advance address status processor address status controller clock chip select chip select chip select byte write inputs output enable global write enable byte write enable power down input burst mode control 32,33,34,35,36,37,43 44,45,46,47,48,49,50 81,82,99,100 83 84 85 89 98 97 92 93,94,95,96 86 88 87 64 31 v dd v ss n.c. dqa 0 ~a 7 dqb 0 ~b 7 dqc 0 ~c 7 dqd 0 ~d 7 dqpa~p d v ddq v ssq power supply(+3.3v) ground no connect data inputs/outputs output power supply (+3.3v) output ground 15,41,65,91 17,40,67,90 14,16,38,39,42,66 52,53,56,57,58,59,62,63 68,69,72,73,74,75,78,79 2,3,6,7,8,9,12,13 18,19,22,23,24,25,28,29 51,80,1,30 4,11,20,27,54,61,70,77 5,10,21,26,55,60,71,76 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 100 pin tqfp (20mm x 14mm) dqpc dqc 0 dqc 1 v ddq v ssq dqc 2 dqc 3 dqc 4 dqc 5 v ssq v ddq dqc 6 dqc 7 n.c. v dd n.c. v ss dqd 0 dqd 1 v ddq v ssq dqd 2 dqd 3 dqd 4 dqd 5 v ssq v ddq dqd 6 dqd 7 dqpd 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 dqpb dqb 7 dqb 6 v ddq v ssq dqb 5 dqb 4 dqb 3 dqb 2 v ssq v ddq dqb 1 dqb 0 v ss n.c. v dd zz dqa 7 dqa 6 v ddq v ssq dqa 5 dqa 4 dqa 3 dqa 2 v ssq v ddq dqa 1 dqa 0 dqpa 1 0 0 9 9 9 8 9 7 9 6 9 5 9 4 9 3 9 2 9 1 9 0 8 9 8 8 8 7 8 6 8 5 8 4 8 3 8 2 a 6 a 7 c s 1 c s 2 w e d w e c w e b w e a c s 2 v d d v s s c l k g w b w o e a d s c a d s p a d v a 8 8 1 a 9 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 3 9 3 8 3 7 3 6 3 5 3 4 3 3 3 2 a 1 5 a 1 4 a 1 3 a 1 2 a 1 1 a 1 0 a 1 7 n . c . v d d v s s n . c . n . c . a 0 a 1 a 2 a 3 a 4 a 5 3 1 l b o a 1 6 KM736V887(256kx36) note : 1. a0 and a1 are the two least significant bits(lsb) of the address field and set the internal burst counter if burst is desir ed.
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 4 - rev 0.2 sep. 1998 KM736V887 pin configuration (top view) pin name symbol pin name tqfp pin no. symbol pin name tqfp pin no. a 0 - a 18 adv adsp adsc clk cs 1 cs 2 cs 2 we x oe gw bw zz lbo address inputs burst address advance address status processor address status controller clock chip select chip select chip select byte write inputs output enable global write enable byte write enable power down input burst mode control 32,33,34,35,36,37,43 44,45,46,47,48,49,50 80,81,82,99,100 83 84 85 89 98 97 92 93,94 86 88 87 64 31 v dd v ss n.c. dqa 0 ~ a 7 dqb 0 ~ b 7 dqpa, pb v ddq v ssq power supply(+3.3v) ground no connect data inputs/outputs output power supply (+3.3v) output ground 15,41,65,91 17,40,67,90 1,2,3,6,7,14,16,25,28,29, 30,38,39,42,51,52,53,56, 57,66,75,78,79,95,96 58,59,62,63,68,69,72,73 8,9,12,13,18,19,22,23 74,24 4,11,20,27,54,61,70,77 5,10,21,26,55,60,71,76 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 100 pin tqfp (20mm x 14mm) n.c. n.c. n.c. v ddq v ssq n.c. n.c. dqb 0 dqb 1 v ssq v ddq dqb 2 dqb 3 n.c. v dd n.c. v ss dqb 4 dqb 5 v ddq v ssq dqb 6 dqb 7 dqpb n.c. v ssq v ddq n.c. n.c. n.c. 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 n.c. n.c. v ddq v ssq n.c. dqpa dqa 7 dqa 6 v ssq v ddq dqa 5 dqa 4 v ss n.c. v dd zz dqa 3 dqa 2 v ddq v ssq dqa 1 dqa 0 n.c. n.c. v ssq v ddq n.c. n.c. n.c. 1 0 0 9 9 9 8 9 7 9 6 9 5 9 4 9 3 9 2 9 1 9 0 8 9 8 8 8 7 8 6 8 5 8 4 8 3 8 2 a 6 a 7 c s 1 c s 2 n . c . n . c . w e b w e a c s 2 v d d v s s c l k g w b w o e a d s c a d s p a d v a 8 8 1 a 9 5 0 4 9 4 8 4 7 4 6 4 5 4 4 4 3 4 2 4 1 4 0 3 9 3 8 3 7 3 6 3 5 3 4 3 3 3 2 a 1 5 a 1 4 a 1 3 a 1 2 a 1 1 a 1 8 n . c . v d d v s s n . c . n . c . a 0 a 1 a 2 a 3 a 4 a 5 3 1 l b o a 1 6 km718v987(512kx18) a 1 7 a 10 note : 1. a0 and a1 are the two least significant bits(lsb) of the address field and set the internal burst counter if burst is desir ed.
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 5 - rev 0.2 sep. 1998 KM736V887 function description the KM736V887 and km718v987 are synchronous sram designed to support the burst address accessing sequence of the power pc based microprocessor. all inputs (with the exception of oe , lbo and zz) are sampled on rising clock edges. the start and dura- tion of the burst access is controlled by adsc , adsp and adv and chip select pins. the accesses are enabled with the chip select signals and output enabled signals. wait states are inserted into the access with adv . when zz is pulled high, the sram will enter a power down state. at this time, internal state of the sram is preserved. when zz returns to low, the sram normally operates after 2cycles of wake up time. zz pin is pulled down internally. read cycles are initiated with adsp (or adsc ) using the new external address clocked into the on-chip address register when both gw and bw are high or when bw is low and we a, we b, we c, and we d are high. when adsp is sampled low, the chip selects are sampled active, and the output buffer is enabled with oe . the data of cell array accessed by the current address are projected to the output pins. write cycles are also initiated with adsp (or adsc ) and are differentiated into two kinds of operations; all byte write operation and individual byte write operation. all byte write occurs by enabling gw (independent of bw and we x.), and individual byte write is performed only when gw is high and bw is low. in KM736V887, a 256kx36 organization, we a controls dqa0 ~ dqa7 and dqpa, we b controls dqb0 ~ dqb7 and dqpb, we c controls dqc0 ~ dqc7 and dqpc and we d controls dqd0 ~ dqd7 and dqpd. cs 1 is used to enable the device and conditions internal use of adsp and is sampled only when a new external address is loaded. adv is ignored at the clock edge when adsp is asserted, but can be sampled on the subsequent clock edges. the address increases internally for the next access of the burst when adv is sampled low. addresses are generated for the burst access as shown below, the starting point of the burst sequence is provided by the externa l address. the burst address counter wraps around to its initial state upon completion. the burst sequence is determined by the st ate of the lbo pin. when this pin is low, linear burst sequence is selected. and this pin is high, interleaved burst sequence is selected. burst sequence table (interleaved burst) lbo pin high case 1 case 2 case 3 case 4 a 1 a 0 a 1 a 0 a 1 a 0 a 1 a 0 first address fourth address 0 0 1 1 0 1 0 1 0 0 1 1 1 0 1 0 1 1 0 0 0 1 0 1 1 1 0 0 1 0 1 0 bq table (linear burst) note : 1. lbo pin must be tied to high or low, and floating state must not be allowed . lbo pin low case 1 case 2 case 3 case 4 a 1 a 0 a 1 a 0 a 1 a 0 a 1 a 0 first address fourth address 0 0 1 1 0 1 0 1 0 1 1 0 1 0 1 0 1 1 0 0 0 1 0 1 1 0 0 1 1 0 1 0
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 6 - rev 0.2 sep. 1998 KM736V887 synchronous truth table note : 1. x means "don t care". 2. the rising edge of clock is symbolized by - . 3. write = l means write operation in write truth table. write = h means read operation in write truth table. 4. operation finally depends on status of asynchronous input pins(zz and oe ). cs 1 cs 2 cs 2 adsp adsc adv write clk address accessed operation h x x x l x x - n/a not selected l l x l x x x - n/a not selected l x h l x x x - n/a not selected l l x x l x x - n/a not selected l x h x l x x - n/a not selected l h l l x x x - external address begin burst read cycle l h l h l x l - external address begin burst write cycle l h l h l x h - external address begin burst read cycle x x x h h l h - next address continue burst read cycle h x x x h l h - next address continue burst read cycle x x x h h l l - next address continue burst write cycle h x x x h l l - next address continue burst write cycle x x x h h h h - current address suspend burst read cycle h x x x h h h - current address suspend burst read cycle x x x h h h l - current address suspend burst write cycle h x x x h h l - current address suspend burst write cycle write truth table (x36) note : 1. x means "don t care". 2. all inputs in this table must meet setup and hold time around the rising edge of clk( - ). gw bw we a we b we c we d operation h h x x x x read h l h h h h read h l l h h h write byte a h l h l h h write byte b h l h h l l write byte c and d h l l l l l write all bytes l x x x x x write all bytes truth tables write truth table(x18) note : 1. x means "don t care". 2. all inputs in this table must meet setup and hold time around the rising edge of clk( - ). gw bw we a we b operation h h x x read h l h h read h l l h write byte a h l h l write byte b h l l l write all bytes l x x x write all bytes
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 7 - rev 0.2 sep. 1998 KM736V887 absolute maximum ratings* *note : stresses greater than those listed under "absolute maximum ratings" may cause permanent damage to the device. this is a stres s rating only and functional operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect reliability. parameter symbol rating unit voltage on v dd supply relative to v ss v dd -0.3 to 4.6 v voltage on v ddq supply relative to v ss v ddq v dd v voltage on input pin relative to v ss v in -0.3 to 4.6 v voltage on i/o pin relative to v ss v io -0.3 to v ddq +0.5 v power dissipation p d 1.4 w storage temperature t stg -65 to 150 c operating temperature t opr 0 to 70 c storage temperature range under bias t bias -10 to 85 c operating conditions (0 c t a 70 c) *note : v dd and v ddq must be supplied with identical vlotage levels . parameter symbol min typ. max unit supply voltage v dd 3.135 3.3 3.465 v v ddq 3.135 3.3 3.465 v ground v ss 0 0 0 v capacitance* (t a =25 c, f=1mhz) *note : sampled not 100% tested. parameter symbol test condition min max unit input capacitance c in v in =0v - 6 pf output capacitance c out v out =0v - 8 pf asynchronous truth table (see notes 1 and 2) : operation zz oe i/o status sleep mode h x high-z read l l dq l h high-z write l x din, high-z deselected l x high-z note 1. x means "don t care". 2. zz pin is pulled down internally 3. for write cycles that following read cycles, the output buffers must be disabled with oe , otherwise data bus contention will occur. 4. sleep mode means power down state of which stand-by current does not depend on cycle time. 5. deselected means power down state of which stand-by current depends on cycle time.
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 8 - rev 0.2 sep. 1998 KM736V887 test conditions parameter value input pulse level 0 to 3v input rise and fall time(measured at 0.3v and 2.7v) 2ns input and output timing reference levels 1.5v output load see fig. 1 (t a =0 to 70 c, v dd =3.3 5%,unless otherwise specified) v ss v ih v ss- 1.0v 20% t cyc (min) dc electrical characteristics (v dd =3.3v 5% t a =0 c to +70 c) notes; 1. reference ac operating conditions and characteristics for input and timing. 2. data states are all zero. 3. in case of i/o pins, the max. v ih =v ddq +0.3v parameter symbol test conditions min max unit notes input leakage current(except zz) i il v dd =max ; v in =v ss to v dd -2 +2 m a output leakage current i ol output disabled, v out =v ss to v ddq -2 +2 m a operating current i cc device selected, i out =0ma, zz v il , cycle time 3 t cyc min -8 - 350 ma 1,2 -9 - 300 -10 - 260 standby current i sb device deselected, i out =0ma, zz v il , f=max, all inputs 0.2v or 3 v dd -0.2v -8 - 130 ma -9 - 120 -10 - 120 i sb1 device deselected, i out =0ma, zz 0.2v, f=0, all inputs=fixed (v dd -0.2v or 0.2v) - 30 ma i sb2 device deselected, i out =0ma, zz 3 v dd -0.2v, f=max, all inputs v il or 3 v ih - 30 ma output low voltage v ol i ol =8.0ma - 0.4 v output high voltage v oh i oh =-4.0ma 2.4 - v input low voltage v il -0.3* 0.8 v input high voltage v ih 2.0 v dd +0.3** v 3
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 9 - rev 0.2 sep. 1998 KM736V887 ac timing characteristics (v dd =3.3v 5%, t a =0 c to +70 c) note : 1. all address inputs must meet the specified setup and hold times for all rising clock edges whenever adsc and/or adsp is sampled low and cs is sampled low. all other synchronous inputs must meet the specified setup and hold times whenever this device is chip selected . 2. both chip selects must be active whenever adsc or adsp is sampled low in order for the this device to remain enabled. 3. adsc or adsp must not be asserted for at least 2 clock after leaving zz state. parameter symbol -8 -9 -10 unit min max min max min max cycle time t cyc 10 - 12 - 12 - ns clock access time t cd - 8.5 - 9.0 - 10 ns output enable to data valid t oe - 3.5 - 3.5 - 3.5 ns clock high to output low-z t lzc 2.5 - 2.5 - 2.5 - ns output hold from clock high t oh 2.5 - 2.5 - 2.5 - ns output enable low to output low-z t lzoe 0 - 0 - 0 - ns output enable high to output high-z t hzoe - 3.5 - 3.5 - 4.0 ns clock high to output high-z t hzc - 5.0 - 5.0 - 6.0 ns clock high pulse width t ch 3.0 - 3.0 - 3.0 - ns clock low pulse width t cl 3.0 - 3.0 - 3.0 - ns address setup to clock high t as 2.0 - 2.0 - 2.0 - ns address status setup to clock high t ss 2.0 - 2.0 - 2.0 - ns data setup to clock high t ds 2.0 - 2.0 - 2.0 - ns write setup to clock high ( gw , bw , we x ) t ws 2.0 - 2.0 - 2.0 - ns address advance setup to clock high t advs 2.0 - 2.0 - 2.0 - ns chip select setup to clock high t css 2.0 - 2.0 - 2.0 - ns address hold from clock high t ah 0.5 - 0.5 - 0.5 - ns address status hold from clock high t sh 0.5 - 0.5 - 0.5 - ns data hold from clock high t dh 0.5 - 0.5 - 0.5 - ns write hold from clock high ( gw , bw , we x ) t wh 0.5 - 0.5 - 0.5 - ns address advance hold from clock high t advh 0.5 - 0.5 - 0.5 - ns chip select hold from clock high t csh 0.5 - 0.5 - 0.5 - ns zz high to power down t pds 2 - 2 - 2 - cycle zz low to power up t pus 2 - 2 - 2 - cycle output load(b),(3.3v i/o) (for t lzc , t lzoe , t hzoe & t hzc ) dout 353 w 5pf* +3.3v 319 w fig. 1 * including scope and jig capacitance output load(a) dout z0=50 w vl=1.5v * capacitive load consists of all components of 30pf* the test environment. rl=50 w
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 10 - rev 0.2 sep. 1998 KM736V887 c l o c k a d s p a d s c a d d r e s s w r i t e c s a d v o e d a t a o u t t i m i n g w a v e f o r m o f r e a d c y c l e n o t e s : w r i t e = l m e a n s g w = l , o r g w = h , b w = l , w e x . = l c s = l m e a n s c s 1 = l , c s 2 = h a n d c s 2 = l c s = h m e a n s c s 1 = h , o r c s 1 = l a n d c s 2 = h , o r c s 1 = l , a n d c s 2 = l t c h t c l t s s t s h t s s t s h t a s t a h a 1 a 2 a 3 b u r s t c o n t i n u e d w i t h n e w b a s e a d d r e s s t w s t w h t c s s t c s h t a d v s t a d v h t o e t h z o e t l z o e t c d t o h ( a d v i n s e r t s w a i t s t a t e ) t h z c q 3 - 4 q 3 - 3 q 3 - 2 q 3 - 1 q 2 - 4 q 2 - 3 q 2 - 2 q 2 - 1 q 1 - 1 d o n t c a r e u n d e f i n e d t c y c
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 11 - rev 0.2 sep. 1998 KM736V887 c l o c k a d s p a d s c a d d r e s s w r i t e c s a d v d a t a i n o e d a t a o u t t c h t c l t s s t s h t a s t a h a 1 a 2 a 3 ( a d s c e x t e n d e d b u r s t ) t l z o e d 2 - 1 d 1 - 1 t c s s t c s h ( a d v s u s p e n d s b u r s t ) d 2 - 2 d 2 - 3 d 2 - 4 d 3 - 1 d 3 - 2 d 3 - 3 d 2 - 2 d 3 - 4 q 0 - 3 q 3 - 4 t s s t s h t w s t w h t a d v s t a d v h t d s t d h t i m i n g w a v e f o r m o f w r t e c y c l e d o n t c a r e u n d e f i n e d t c y c
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 12 - rev 0.2 sep. 1998 KM736V887 t i m i n g w a v e f o r m o f c o m b i n a t i o n r e a d / w r t e c y c l e ( a d s p c o n t r o l l e d , a d s c = h i g h ) c l o c k a d s p a d d r e s s w r i t e c s a d v o e d a t a o u t t c h t c l t d s t d h q 3 - 3 d a t a i n t o e t o h a 1 a 2 a 3 d 2 - 1 q 3 - 1 q 3 - 2 q 3 - 4 t s s t s h t a s t a h t w s t w h t a d v s t a d v h t l z o e t h z o e t c d t h z c t l z c d o n t c a r e u n d e f i n e d t c y c q 1 - 1
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 13 - rev 0.2 sep. 1998 KM736V887 t i m i n g w a v e f o r m o f s i n g l e r e a d / w r i t e c y c l e ( a d s c c o n t r o l l e d , a d s p = h i g h ) c l o c k a d s c a d d r e s s w r i t e c s a d v o e d a t a i n t c h t c l t h z o e d 6 - 1 d a t a o u t t w s t w h t c d t o h t o e d 5 - 1 d 7 - 1 t w s t w h t l z o e t d h t d s a 1 a 2 a 3 a 4 a 5 a 6 a 7 a 8 a 9 q 3 - 1 q 1 - 1 q 2 - 1 q 4 - 1 q 8 - 1 q 9 - 1 t c s s t c s h t s s t s h d o n t c a r e u n d e f i n e d t c y c
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 14 - rev 0.2 sep. 1998 KM736V887 d 7 - 1 t i m i n g w a v e f o r m o f s i n g l e r e a d / w r i t e c y c l e ( a d s p c o n t r o l l e d , a d s c = h i g h ) c l o c k a d s p a d d r e s s w r i t e c s a d v o e d a t a i n t c h t c l t h z o e d a t a o u t t a s t a h t c d t o h t o e d 5 - 1 t l z o e t d h t d s a 1 a 2 a 3 a 4 a 5 a 6 a 9 q 3 - 1 q 1 - 1 q 2 - 1 q 4 - 1 q 8 - 1 q 9 - 1 t c s s t c s h t s s t s h a 7 a 8 d 6 - 1 d o n t c a r e u n d e f i n e d t c y c
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 15 - rev 0.2 sep. 1998 KM736V887 t i m i n g w a v e f o r m o f p o w e r d o w n c y c l e c l o c k a d s p a d d r e s s w r i t e c s a d v d a t a i n t c h t c l d 2 - 2 o e t w h t h z o e t l z o e d 2 - 1 a 1 t s s t s h d a t a o u t t p u s a 2 a d s c q 1 - 1 z z t a s t a h t c s s t c s h t o e t h z c t p d s s l e e p s t a t e z z s e t u p c y c l e n o r m a l o p e r a t i o n m o d e z z r e c o v e r y c y c l e t w s d o n t c a r e u n d e f i n e d t c y c
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 16 - rev 0.2 sep. 1998 KM736V887 application information depth expansion data address clk ads cs 2 cs 2 clk adsc we x oe cs 1 address data adv adsp 256kx36 sb sram (bank 0) cs 2 cs 2 clk adsc we x oe cs 1 address data adv adsp 256kx36 sb sram (bank 1) clk address cache controller a [0:18] a [18] a [0:17] a [18] a [0:17] i/o [0:71] microprocessor *notes n = 14 32k depth 15 64k depth 16 128k depth 17 256k depth 18 512k depth 19 1024k depth clock adsp address data out interleave read timing (refer to non-interleave write timing for interleave write timing) bank 0 is selected by cs 2 , and bank 1 deselected by cs 2 q1-1 q1-2 q1-4 q1-3 oe data out t ss t sh a1 a2 write cs 1 a n+1 adv (bank 0) (bank 1) q2-1 q2-2 q2-4 q2-3 t as t ah t css t csh t ws t wh t advs t advh t oe t lzoe t hzc bank 0 is deselected by cs 2 , and bank 1 selected by cs 2 [0:n] don t care undefined t cd t lzc the samsung 256kx36 synchronous burst sram has two additional chip selects for simple depth expansion. this permits easy secondary cache upgrades from 256k depth to 512k depth without extra logic. ( adsp controlled , adsc =high)
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 17 - rev 0.2 sep. 1998 KM736V887 application information the samsung 512kx18 synchronous burst sram has two additional chip selects for simple depth expansion. depth expansion this permits easy secondary cache upgrades from 512k depth to 1024k depth without extra logic. data address clk ads microprocessor cs 2 cs 2 clk adsc we x oe cs 1 address data adv adsp 512kx18 sb sram (bank 0) cs 2 cs 2 clk adsc we x oe cs 1 address data adv adsp 512kx18 sb sram (bank 1) clk address cache controller a [0:19] a [19] a [0:18] a [19] a [0:18] i/o [0:71] clock adsp address data out interleave read timing (refer to non-interleave write timing for interleave write timing) bank 0 is selected by cs 2 , and bank 1 deselected by cs 2 q1-1 q1-2 q1-4 q1-3 oe data out t ss t sh a1 a2 write cs 1 a n+1 adv (bank 0) (bank 1) q2-1 q2-2 q2-4 q2-3 t as t ah t css t csh t ws t wh t advs t advh t oe t lzoe t hzc bank 0 is deselected by cs 2 , and bank 1 selected by cs 2 [0:n] don t care undefined t cd t lzc *notes n = 14 32k depth 15 64k depth 16 128k depth 17 256k depth 18 512k depth 19 1024k depth ( adsp controlled , adsc =high)
preliminary km718v987 256kx36 & 512kx18 synchronous sram - 18 - rev 0.2 sep. 1998 KM736V887 package dimensions 0.10 max 0~8 22.00 0.30 20.00 0.20 16.00 0.30 14.00 0.20 1.40 0.10 1.60 max 0.05 min (0.58) 0.50 0.10 #1 (0.83) 0.50 0.10 100-tqfp-1420a 0.65 0.30 0.10 0.10 max + 0.10 - 0.05 0.127 units ; millimeters/inches


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